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2L 30mil Rogers 4350 PCB High Frequency PCB

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2L 30mil Rogers 4350 PCB High Frequency PCB

Brand Name : bicheng

Model Number : BIC-002-V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1 pcs

Price : USD 9.99-99.99 per piece

Payment Terms : T/T

Supply Ability : 50000 pcs per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+ Cartons

Base material : RO4350B

Thickness : 0.8mm

Copper weight : 1oz

Surface finish : immersion gold

Layer count : 2 layers

PCB size : 93 x 92 mm

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High Frequency PCB 30mil Rogers 4350 PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Hydrocarbon ceramic laminates with the part number RO4350B are intended to provide improved high frequency performance and inexpensive circuit manufacturing. Once working frequencies reach 500 MHz and beyond, designers have a much smaller number of laminates to choose from. The qualities required by designers of RF microwave circuits, matching networks, and controlled impedance transmission lines are present in the material RO4350B. Since standard circuit board materials cannot be used in many applications due to higher operating frequencies, low dielectric loss makes it possible to employ RO4350B material in these applications.

The temperature coefficient of dielectric constant is among the lowest of any circuit board material, and the dielectric constant is stable over a broad frequency range. RO4350B material's thermal coefficient of expansion(CTE) provides several key benefits to the PCB designers. The expansion coefficient of RO4350B is similar to that of copper which allows the material to exhibit excellent dimensional stability, a property needed for mixed dielectric multi-layer boards constructions. The low Z-axis CTE of RO4350B provides reliable plated through-hole quality, even in severe thermal shock applications. RO4350B material has a Tg of >280C so its expansion characteristics remain stable over the entire range of PCB processing temperatures.

PCB Specifications

PCB SIZE 93 x 92mm=1PCS
BOARD TYPE
Number of Layers Double sided PCB, 2 Layer PCB
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 17.8um(0.5oz)+plate TOP layer
RO4350B 30mil (0.762mm)
copper ------- 17.8um(1oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 11.97mil
Minimum / Maximum Holes: 0.3/2.8mm
Number of Different Holes: 2
Number of Drill Holes: 195
Number of Milled Slots: 5
Number of Internal Cutouts: 0
Impedance Control No
BOARD MATERIAL
Glass Epoxy: RO4350B 30mil (0.762mm), Tg 288℃
Final foil external: 1oz
Final foil internal: 0oz
Final height of PCB: 0.8mm ±0.1
PLATING AND COATING
Surface Finish Immersion Gold (16.2%) 2 micoinch over 100 microinch nickel
Solder Mask Apply To: NO
Solder Mask Color: NO
Solder Mask Type: N/A
CONTOUR/CUTTING Routing, Fiducial Marks
MARKING
Side of Component Legend NO
Colour of Component Legend NO
Manufacturer Name or Logo: N/A
VIA Plated Through Hole(PTH)
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059" (0.15mm)
Board plating: 0.0030" (0.076mm)
Drill tolerance: 0.002" (0.05mm)
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Typical applications are as follows:

  1. Automotive Radar and Sensors
  2. Cellular Base Station Antennas
  3. Direct Broadcast Satellites
  4. Low Noise Block
  5. Power amplifiers
  6. RFID

2L 30mil Rogers 4350 PCB High Frequency PCB

Data sheet of Rogers 4350 (RO4350B)

RO4350B Typical Value
Property RO4350B Direction Units Condition Test Method
Dielectric Constant,εProcess 3.48±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.66 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0037
0.0031
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +50 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 x109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 16,767(2,432)
14,153(2,053)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 203(29.5)
130(18.9)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 255
(37)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 10
12
32
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃ TMA A IPC-TM-650 2.4.24.3
Td 390 ℃ TGA ASTM D 3850
Thermal Conductivity 0.69 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.86 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 0.88
(5.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability (3)V-0 UL 94
Lead-free Process Compatible Yes


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RO4350B RF PCB Board

      

0.762mm RF PCB Board

      

0.762mm Double Sided Copper PCB

      
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