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Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

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Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

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Brand Name : Bicheng

Model Number : BIC-050.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RO3010

Layer count : 2 layers

PCB thickness : 1.4mm

PCB size : 75 x 80 mm = 1 PCS

Solder mask : Green

Silkscreen : White

Copper weight : 0.5oz

Surface finish : immersion gold

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Rogers Microwave PCB Made on RO3010 50mil 1.270mm DK10.2 With Immersion Gold for Power Amplifiers and Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RO3010 high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. It was designed to offer exceptional electrical and mechanical stability at competitive prices. The mechanical properties are consistent. This allows the designer to develop multi-layer board designs without encountering warpages or reliability problems. RO3010 materials exhibit a coefficient of thermal expansion(CTE) in the X and Y axis of 17 ppm/℃. This expansion coefficient is matched to that of copper, which allows the material to exhibit excellent dimensional stability, with typical etch shrinkage, after etch and bake, of less than 0.5 mils per inch. The Z-axis CTE is 24 ppm/℃, which provides exceptional plated through-hole reliability, even in severe environments.

The typical applications are cellular telecommunications systems, direct broadcast satellites, patch antenna for wireless communications, power backplanes etc.

PCB Specifications

PCB SIZE 75 x 80 mm = 1 PCS
BOARD TYPE High Frequency PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 18um(0.5 oz)+plate TOP layer
RO3010 1.270mm
copper ------- 18um(0.5 oz)+plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 5.8mil/5.4mil
Minimum / Maximum Holes: 0.4mm / 0.6mm
Number of Different Holes: 1
Number of Drill Holes: 4
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RO3010 1.270mm
Final foil external: 1oz
Final foil internal: 0oz
Final height of PCB: 1.4mm ± 10%
PLATING AND COATING
Surface Finish Immersion Gold
Solder Mask Apply To: TOP
Solder Mask Color: Green
Solder Mask Type: N/A
CONTOUR/CUTTING Routing, V-cut
MARKING
Side of Component Legend TOP
Colour of Component Legend White
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH)
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Microwave RO3010 Rogers PCB Board 50mil 1.270mm DK10.2 For Power Amplifiers

Data Sheet of Rogers 3010 (RO3010)

RO3010 Typical Value
Property RO3010 Direction Units Condition Test Method
Dielectric Constant,εProcess 10.2±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 11.2 Z 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0022 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -395 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650 2.5.5.5
Dimensional Stability 0.35
0.31		 X
Y		 mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105 MΩ.cm COND A IPC 2.5.17.1
Surface Resistivity 105 MΩ COND A IPC 2.5.17.1
Tensile Modulus 1902
1934		 X
Y		 MPa 23℃ ASTM D 638
Moisture Absorption 0.05 % D48/50 IPC-TM-650 2.6.2.1
Specific Heat 0.8 j/g/k Calculated
Thermal Conductivity 0.95 W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)		 13
11
16		 X
Y
Z		 ppm/℃ 23℃/50% RH IPC-TM-650 2.4.4.1
Td 500 ℃ TGA ASTM D 3850
Density 2.8 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 9.4 Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0 UL 94
Lead-free Process Compatible Yes


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