We are excited to introduce our newly shipped 2-layer PCB constructed from Rogers TMM4 material, designed specifically for high-performance applications in RF and microwave technology.
PCB Construction Details
Our 2-layer PCB is meticulously crafted with the following specifications:
- Base Material: TMM4, a ceramic hydrocarbon thermoset polymer composite, known for its superior reliability and performance.
- Layer Count: 2 layers, allowing for compact designs without compromising functionality.
- Board Dimensions: 45mm x 54mm, with a tolerance of +/- 0.15mm, ensuring precision in manufacturing.
- Minimum Trace/Space: 4/6 mils, enabling the design of intricate circuit layouts.
- Minimum Hole Size: 0.3mm, accommodating the integration of small components.
- Finished Board Thickness: 1.3mm, providing a robust yet lightweight profile.
- Finished Copper Weight: 1 oz (1.4 mils) on outer layers, ensuring strong electrical connectivity.
- Via Plating Thickness: 20 μm, enhancing the durability and reliability of connections.
- Surface Finish: Immersion Gold, offering excellent solderability and protection against oxidation.
- Silkscreen: White on the top for clear component identification; no silkscreen on the bottom.
- Solder Mask: Blue on the top; none on the bottom, facilitating easier inspection and assembly.
- Electrical Testing: Each board undergoes 100% electrical testing prior to shipment, guaranteeing high reliability.
Stackup Configuration
The stackup of this PCB is designed for optimal electrical performance:
- Copper Layer 1: 35 μm
- Rogers TMM4 Core: 1.27 mm (50 mil)
- Copper Layer 2: 35 μm
This configuration optimizes signal integrity and minimizes losses, making it suitable for high-frequency applications.
| Property | TMM4 | Direction | Units | Condition | Test Method |
| Dielectric Constant,εProcess | 4.5±0.045 | Z | | 10 GHz | IPC-TM-650 2.5.5.5 |
| Dielectric Constant,εDesign | 4.7 | - | - | 8GHz to 40 GHz | Differential Phase Length Method |
| Dissipation Factor (process) | 0.002 | Z | - | 10 GHz | IPC-TM-650 2.5.5.5 |
| Thermal Coefficient of dielectric constant | +15 | - | ppm/°K | -55℃-125℃ | IPC-TM-650 2.5.5.5 |
| Insulation Resistance | >2000 | - | Gohm | C/96/60/95 | ASTM D257 |
| Volume Resistivity | 6 x 108 | - | Mohm.cm | - | ASTM D257 |
| Surface Resistivity | 1 x 109 | - | Mohm | - | ASTM D257 |
| Electrical Strength(dielectric strength) | 371 | Z | V/mil | - | IPC-TM-650 method 2.5.6.2 |
| Thermal Properties |
| Decompositioin Temperature(Td) | 425 | 425 | ℃TGA | - | ASTM D3850 |
| Coefficient of Thermal Expansion - x | 16 | X | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Y | 16 | Y | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Coefficient of Thermal Expansion - Z | 21 | Z | ppm/K | 0 to 140 ℃ | ASTM E 831 IPC-TM-650, 2.4.41 |
| Thermal Conductivity | 0.7 | Z | W/m/K | 80 ℃ | ASTM C518 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress | 5.7 (1.0) | X,Y | lb/inch (N/mm) | after solder float 1 oz. EDC | IPC-TM-650 Method 2.4.8 |
| Flexural Strength (MD/CMD) | 15.91 | X,Y | kpsi | A | ASTM D790 |
| Flexural Modulus (MD/CMD) | 1.76 | X,Y | Mpsi | A | ASTM D790 |
| Physical Properties |
| Moisture Absorption (2X2) | 1.27mm (0.050") | 0.07 | - | % | D/24/23 | ASTM D570 |
| 3.18mm (0.125") | 0.18 |
| Specific Gravity | 2.07 | - | - | A | ASTM D792 |
| Specific Heat Capacity | 0.83 | - | J/g/K | A | Calculated |
| Lead-Free Process Compatible | YES | - | - | - | - |
Material Insights: TMM4
Overview of TMM4
Rogers TMM4 is a thermoset microwave material that combines the best properties of both ceramic and traditional PTFE laminates. This material is designed for high reliability in plated-through-hole applications, making it ideal for various demanding environments. The thermoset resin composition ensures that the PCB can withstand rigorous manufacturing processes without compromising performance.
Key Features
- Dielectric Constant (Dk): 4.50 +/- 0.045, ensuring minimal signal loss and high fidelity.
- Dissipation Factor: 0.0020 at 10 GHz, contributing to efficient energy usage.
- Thermal Coefficient of Dk: 15 ppm/°K, providing stability across temperature variations.
- Coefficient of Thermal Expansion (CTE): Matched to copper, ensuring dimensional stability during thermal cycles:
- X: 16 ppm/°K
- Y: 16 ppm/°K
- Z: 21 ppm/°K
- Decomposition Temperature (Td): 425 °C, allowing for high-temperature applications.
- Thermal Conductivity: 0.7 W/mK, enhancing heat dissipation.
- Moisture Absorption: 0.07%-0.18%, ensuring reliability in humid environments.
Benefits of TMM4
1. Mechanical Strength: The material's properties resist creep and cold flow, ensuring durability in high-stress environments.
2. Chemical Resistance: TMM4 is resistant to process chemicals, reducing damage during fabrication.
3. Reliable Wire-Bonding: The thermoset resin allows for effective wire-bonding without pad lifting or substrate deformation.
4. High Reliability of Plated Through Holes: Ensures robust electrical connections in various applications.
5. Compatibility with Common PCB Processes: TMM4 materials can be utilized with standard fabrication techniques, simplifying production.
Typical Applications
This 2-layer PCB is perfectly suited for a variety of applications, including:
- RF and Microwave Circuitry: Ideal for communication systems where signal integrity is crucial.
- Power Amplifiers and Combiners: Designed to handle high power levels effectively.
- Filters and Couplers: Providing essential functionality in signal processing.
- Satellite Communication Systems: Enabling reliable connections in challenging environments.
- Global Positioning Systems (GPS) Antennas: Ensuring accurate positioning and navigation.
- Patch Antennas: Suitable for various wireless communication applications.
- Dielectric Polarizers and Lenses: Supporting advanced optical systems.
- Chip Testers: Facilitating testing and validation of semiconductor devices.
Conclusion
In conclusion, our newly shipped 2-layer PCB featuring Rogers TMM4 material represents a significant advancement in PCB technology. With its exceptional electrical performance, robust construction, and versatility across various applications, this PCB is designed to meet the needs of modern electronic systems.
By choosing this TMM4 PCB, you are investing in a product that emphasizes reliability, performance, and innovation. We are committed to providing our customers with the highest quality products.
For inquiries or to place an order, please contact our sales team today!
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TMM4 PCB 50 Mil 2 Layer RF Circuits Immersion Gold Finished Images
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