Introducing the F4BTMS1000, a state-of-the-art dual-layer printed circuit board (PCB) meticulously engineered for high-performance applications in sectors such as aerospace, telecommunications, and advanced electronics. This PCB utilizes cutting-edge material technology and superior manufacturing processes, ensuring exceptional reliability and performance tailored to meet the rigorous demands of modern technology.
Key Specifications
- Base Material: F4BTMS1000, an advanced composite material
- Layer Count: 2 layers, providing a compact design
- Board Dimensions: 85mm x 40mm (with a tolerance of ± 0.15mm)
- Minimum Trace and Space: 4 mils by 4 mils, allowing for intricate designs
- Minimum Hole Size: 0.3mm, accommodating a variety of components
- Finished Board Thickness: 0.6mm, ensuring robustness
- Finished Copper Weight: 1oz (1.4 mils) on outer layers for optimal conductivity
- Via Plating Thickness: 20 μm, enhancing durability
- Surface Finish: OSP (Organic Solderability Preservative), promoting solderability
- Silkscreen: None on both top and bottom surfaces for a clean finish
- Solder Mask: None on both top and bottom, allowing for custom applications
- Electrical Testing: 100% electrical testing is conducted prior to shipment to guarantee quality
PCB Stackup
The construction of the F4BTMS1000 features a precise stackup:
- Copper Layer 1: 35 μm providing excellent conductivity
- Core (F4BTMS1000): 0.508 mm (20 mil), ensuring structural integrity
- Copper Layer 2: 35 μm, delivering consistent performance
Quality Assurance
The F4BTMS1000 PCB adheres to IPC-Class-2 quality standards, ensuring it meets the highest levels of reliability and performance. Available worldwide, this PCB is ready to be deployed in your next innovative project.
Advanced Material Features
The F4BTMS1000 is constructed from the F4BTMS series, which features significant advancements in material formulation. This includes a unique blend of ceramics and ultra-thin glass fiber cloth, yielding improved performance characteristics such as:
- High Dielectric Constant (Dk): 10.2 at 10GHz, ideal for high-frequency applications
- Low Dissipation Factor: .0020 at 10GHz and .0023 at 20GHz, minimizing energy loss
- Controlled Thermal Expansion (CTE): 16 ppm/°C (x-axis), 18 ppm/°C (y-axis), and 32 ppm/°C (z-axis), providing stability across temperature ranges
- Exceptional Thermal Conductivity: 0.81 W/mk, enhancing heat dissipation
- Minimal Moisture Absorption: 0.03%, ensuring reliability in humid environments
Applications
These remarkable features make the F4BTMS1000 suitable for a wide range of applications, including but not limited to:
- Aerospace equipment, including space and cabin technology
- Microwave and RF systems for telecommunications
- Military radar applications
- Advanced feed networks
- Phase-sensitive antennas and phased array systems
- Satellite communications and various high-tech applications
Conclusion
The F4BTMS1000 PCB represents the pinnacle of engineering excellence, combining advanced materials with precise manufacturing to deliver a product that stands out in both quality and performance. Its unique features and versatility make it an exceptional choice for cutting-edge technologies. Choose the F4BTMS1000 for your next project and experience the significant advantages that come with superior engineering.
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F4BTMS1000 PCB Double-Sided 0.508mm OSP Finished Images
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