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Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

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Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

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Brand Name : Bicheng

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99/PCS

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Material : RO4003C and FR-4

Layer count : 6-layer

PCB size : 83.50mm x 66mm=1PCS, +/- 0.15mm

PCB thickness : 1.1mm

Copper weight : 1oz (1.4 mils) inner/outer layers

Surface finish : Immersion Gold

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We are excited to announce our newly shipped 6-layer printed circuit board (PCB) designed with Rogers RO4003C materials. This innovative PCB combines exceptional electrical performance with manufacturing ease, making it a perfect solution for high-frequency applications.


Key Features

RO4003C Material

- Dielectric Constant (Dk): 3.38 ± 0.05 at 10 GHz
- Dissipation Factor: 0.0027 at 10 GHz
- Thermal Conductivity: 0.71 W/m/°K
- Thermal Coefficient of Dielectric Constant: +40 ppm/°C (operating range: -50°C to 150°C)
- CTE Matched to Copper:
- X axis: 11 ppm/°C
- Y axis: 14 ppm/°C
- Z-axis CTE: 46 ppm/°C
- Glass Transition Temperature (Tg): >280 °C
- Moisture Absorption: 0.06%
- Non-Brominated

RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z 10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z 8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z 10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010 MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109 COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
MPa
(kpsi)
IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280 ℃ TMA A IPC-TM-650 2.4.24.3
Td 425 ℃ TGA ASTM D 3850
Thermal Conductivity 0.71 W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06 % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79 gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A UL 94
Lead-free Process Compatible Yes

S1000-2M Features

- Enhanced Z-axis CTE for improved through-hole reliability
- Excellent mechanical processability and thermal resistance
- Lead-free compatibility
- Tg: 180°C (DSC)
- UV blocking and AOI compatible
- High heat resistance with superior anti-CAF performance
- Low water absorption


PCB Specifications

- Layer Stackup:
- Copper Layer 1: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 2: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 3: 35 μm
- FR-4 (Tg 170): 0.076 - 0.203 mm (3 mil)
- Copper Layer 4: 35 μm
- Prepreg Bondply (1080 RC63%): 0.0644 mm (2.5 mil)
- Copper Layer 5: 35 μm
- RO4003C Core: 0.305 mm (12 mil)
- Copper Layer 6: 35 μm

- Dimensions: 83.50 mm x 66 mm ± 0.15 mm
- Finished Board Thickness: 1.1 mm
- Finished Copper Weight: 1 oz (1.4 mils) on both inner and outer layers
-Minimum Trace/Space: 4/4 mils
- Minimum Hole Size: 0.2 mm
- Via Plating Thickness: 20 μm
- Surface Finish: Immersion Gold
- Solder Mask Color: Matt Green (top and bottom)
- Silkscreen Color: White (top only)
- Impedance Control: 50 ohm on 4 mil / 4 mil traces/gaps (top layer)
- Via Configuration: 0.2 mm via filled and capped
- Electrical Testing: 100% before shipment

Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled

Typical Applications

This PCB is ideal for a variety of advanced applications, including:

- Commercial airline broadband antennas
- Microstrip and stripline circuits
- Millimeter wave applications
- Radar systems
- Guidance systems
- Point-to-point digital radio antennas


Quality Assurance

Manufactured to IPC-Class 2 standards, our PCB ensures high reliability and performance. The artwork is supplied in Gerber RS-274-X format, compatible with most PCB design tools.


Global Availability

Our high-performance PCB is available for worldwide shipping, providing cutting-edge solutions wherever you are located.

Hybrid PCB 6-Layer Featuring RO4003C and FR4 Material Impedance Controlled


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