Introduction to the AD255C PCB
In the fast-paced world of telecommunications, the choice of materials can make or break the performance of your devices. The AD255C antenna PCB stands at the forefront of innovation, boasting glass-reinforced, PTFE-based laminates that deliver exceptional dielectric properties and low loss performance. Designed for a variety of microwave and RF applications, the AD255C is a game-changer for cellular infrastructure and automotive telematics.
Key Features and Specifications
Low Loss and High Efficiency
The AD255C substrate is engineered with a dielectric constant of 2.55 and a dissipation factor of just 0.0013 at 10 GHz. This combination ensures minimal signal loss, crucial for maintaining the integrity of high-frequency signals. With a decomposition temperature exceeding 500°C, the material withstands demanding thermal conditions, making it reliable for long-term use.
Tailored for Performance
This PCB features a 2-layer rigid stackup with a finished thickness of 1.1mm and copper weights of 1oz on the outer layers. This construction not only enhances mechanical strength but also guarantees robust electrical performance, ensuring that your communication devices operate seamlessly.
Moisture and Thermal Resistance
With a moisture absorption rate of only 0.03%, the AD255C PCB is built to resist environmental challenges, ensuring consistent performance in various conditions. Furthermore, the thermal properties are noteworthy, featuring coefficients of thermal expansion (CTE) of 34 ppm/°C in the X-axis and 26 ppm/°C in the Y-axis, which contribute to its phase stability.
| Electrical Properties | AD255C | Units | Test Conditions | Test Method |
| PIM (30mil/60mil) | -159/-163 | dBc | Reflected 43 dBm swept tones at 1900 MHz, S1/S1 | Rogers Internal 50 ohm |
| Dielectric Constant (process) | 2.55 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5
(IPC TM-650 2.5.5.3) |
| Dielectric Constant (design) | 2.60 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Dissipation Factor (process) | 0.0013 | - | 23°C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Thermal Coefficient of Dielectric Constant | -110 | ppm/ºC | 0°C to 100°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 7.4 x 108 | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 3.6 x 107 | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 911 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | >40 | kV | D-48/50 | X/Y direction | IPC TM-650 2.5.6 |
| Thermal Properties |
| Decomposition Temperature (Td) | >500 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 34 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 26 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 196 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.35 | W/mK | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties |
| Copper Peel Strength after Thermal Stress | 2.4
(13.6) | N/mm (lbs/in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD/CMD) | 8.8/6.4 (60.7/44.1) | MPa (ksi ) | 25°C ± 3°C | - | ASTM D790 |
| Tensile Strength (MD/CMD) | 8.1/6.6 (55.8/45.5) | MPa (ksi ) | 23°C/50% RH | - | ASTM D3039/D3039-14 |
| Flex Modulus (MD/CMD) | 930/818 (6,412/5,640) | MPa (ksi ) | 25°C ± 3°C | - | IPC-TM-650 Test Method 2.4.4 |
| Dimensional Stability (MD/CMD) | 0.03/0.07 | mils/inch | after etch + bake | - | IPC-TM-650 2.4.39a |
| Physical Properties |
| Flammability | V-0 | - | - | - | UL-94 |
| Moisture Absorption | 0.03 | % | E1/105 +D48/50 | - | IPC TM-650 2.6.2.1 |
| Density | 2.28 | g/cm3 | C-24/23/50 | - | ASTM D792 |
| Specific Heat Capacity | 0.813 | J/g°K | 2 hours at 105°C | - | ASTM E2716 |
Benefits of the AD255C Antenna PCB
Enhanced Signal Integrity
The AD255C PCB is designed to minimize insertion loss and passive intermodulation (PIM), crucial for antenna applications. With PIM values reaching as low as -163 dBc, this PCB ensures clear and reliable communication, essential for base station antennas.
Compatibility and Reliability
Its compatibility with standard PTFE-based PCB processing techniques allows for easy integration into existing manufacturing workflows. Each unit undergoes 100% electrical testing prior to shipment, ensuring that you receive a product that meets high industry standards.
| PCB Material: | Glass-reinforced, PTFE based Composites |
| Designation: | AD255C |
| Dielectric constant: | 2.55 (10 GHz) |
| Dissipation Factor | 0.0013 (10 GHz) |
| Layer count: | Double Sided PCB, Multilayer PCB, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| Dielectric thickness: | 20mil (0.508mm), 30mil (0.762mm), 40mil (1.016mm), 60mil (1.524mm), 125mil (3.175mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion silver, Immersion tin, OSP, Pure gold plated etc.. |
Applications
The versatility of the AD255C makes it suitable for a wide range of applications, including:
- Cellular Infrastructure Base Station Antennas: Essential for maintaining robust mobile communication networks.
- Automotive Telematics Systems: Providing connectivity and navigation solutions for modern vehicles.
- Commercial Satellite Radio Antennas: Ensuring high-fidelity signal transmission for satellite communications.
Conclusion
When it comes to choosing a PCB for microwave and RF applications, the AD255C antenna PCB emerges as a top contender. With its exceptional specifications, low loss characteristics, and robust design, it is tailored to meet the rigorous demands of modern telecommunications. Elevate your projects with the AD255C and experience unparalleled performance and reliability.
Whether you are in cellular infrastructure or satellite communications, the AD255C is your go-to solution for superior signal integrity and efficiency. Contact us today if you have any inquiry about PCB project.
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